EMC/EMI Course Syllabus

  • Introduction to EMC

    • Background terms and definitions

  • Commercial and Military Standards on EMC

    • Brief description of the Purpose and intent of the standards, with focus on those requirements which are difficult to meet
    RF Microwave and wireless Free Tutorial-Noise in Communication Systems

  • Spectrum and time domain signals

    • Spectrum of communication data signals, clocks and switching mode power supplies.
    • Engineering aspects of the parameters which often cause failures in EMC Compliance testing

  • Cables in EMC: as radiators and as radiation receptors

    • A cable as an elementary antenna and its extension to electrically long cables.
    • Identification of the parameters determining the radiation intensity and controlling them
    • The Model of a cable as a receptor of Electromagnetic Radiation,
    • Identification of the parameters determining the amplitude of the reception and controlling

  • Switched Mode power supplies

    • Sources of interference in switched mode power supplies-SMPS,
    • Identification of the generators of interference and their control, filtering an SMPS to comply with the requirements of conducted Emissions on the power leads.

  • Filtering of conducted interference

    • Principles of EMI Filtering,
    • Structure and topology of common filters,
    • Limitations of filtering components,
    • Selection of a filter based on termination impedances and filtering requirements.
    • Filtered pin connectors.
    • The importance of the placement of the filter,
    • Considerations when selecting or designing a filter

  • Shielding

    • The need for shielding,
    • Materials used for shielding,
    • Properties of metals conducive to shielding,
    • Basic shielding theory,
    • Engineering results as to the materials to be used,
    • Shielding integrity faults due to penetrations and apertures and how to control them, engineering results as to bolt spacing.
    • Cable shielding, gaskets, vents, viewing ports

  • Transients

    • Sources of transients,
    • Expression for transient immunity in the standards for lightning,
    • Inductive load switching and ESD.
    • Selection of TVS transient voltage suppressor components to comply with the standards

  • Grounding

    • Purpose of grounding,
    • Impedance of conductors used for grounding,
    • Single and multiple point grounding,
    • Hi speed board grounding
    RF Microwave and Wireless free Tutorial-Introduction

  • Bonding

    • Bonding for electrical continuity,
    • Electro-chemical properties of metals, corrosion effects, surface treatment to avoid corrosion,
    • Bonding resistance requirements

  • EMC aspects of Electronic Circuit Design

    • Selection of electronic component technology to minimize conducted and radiated Emissions.
    • Board design for component placement, layer stack-up, separation of traces, area segregation in ground and power planes,
    • Pin allocation in board to mother board connectors,
    • On board filtering

  • Preparedness for EMC Lab testing

    • The requirements of the standards,
    • The EMC Test Plan,
    • Setting the modes of operation, setting the pass-fail criteria, separation between the equipment being tested and the associated controlling-operating equipment

  • Spectral Analysis

    • Signals in time and Frequency Domain
    • Types of Spectrum Analyzers
    • Basic Block Diagram of an Analog SA
    • The SA as a Receiver
    • Selectivity, AGC, LO Phase Noise
    • Microwaves Spectrum Analyzer
    • Frequency Resolution and RBW
    • Limitations on the Sweep Rate
    • RF Attenuator
    • IF Amplification
    • Shape Factor of the RBW Filter and Sweep Rate
    • Noise Floor
    • Video Signal Filtering (Post-Detection)
    • Filtering by Averaging Screens
    • SA Controls (Span, RBW, Att, VBW)
    • Dynamic Range
    • Detector Types and their Characteristics
    • Sampling and the Sampling Theorem
    • Spectrum of a Uniformly Sampled Signal
    • Artifacts in Digitally Processed Spectrum Display
    • Side-Lobes in Frequency Domain and Windowing
    • RBW broadening by Windowing
    • 2nd and 3rd Order Distortions and Spurii – Identification of Saturation in the SA
    • Effect of LO Phase Noise
    • Residual FM
    • Time Domain Measurements – Zero Span
    • Signal Power response in time
    • Intermodulation Measurements
    • Intermodulation with two-tones Stimulus
    • Adjacent channel power (ACP)
    • Adjacent channel leakage ratio (ACLR)
    • Tracking Generator Configuration and Scalar Network Analyzer Measurements
    • Demonstration of SA operation and Measurements

  • Vector Network Analyzer

    • Introduction to the Network Analyzer
    • Measurement Types Performed by the VNA
    • Scalar and Vector Network Analysis
    • Review of Transmission Lines
    • Transmission and Reflection Parameters
    • S parameters
    • Construction of the VNA
    • Coupling to the Measured Signals
    • Detection Types
    • Dynamic Range
    • T/R Setup versus S-Parameters Measurements
    • Types of Measurements Errors
    • Basic Error Models and Calibration
    • One-Port and Two-Port Models
    • Review of Calibration Methodologies for Minimization of Errors
    • Measurements Review – Power Sweep for AM/AM, AM/PM, and Harmonics
    • Time Domain Measurements (TDR)
    • Demonstration of VNA operation and Measurements

  • EMC/EMI Simulation using the CST EMC STUDIO® software

    • Solver Choice for EMC Applications
    • Basic Meshing
    • Circuit and 3D System Level Simulations
    • Workflow examples:
      • Conducted Emission: DC DC Converter
      • Panel Shielding Effectiveness
      • Lightning Strike Simulation
      • Electro Static Discharge (ESD)
      • USB Example: Cascading
      • Conducted Emission: DC DC Converter
      • Radiated Emission
      • Rule based EMC checking

  • Fundamentals of PCB design for Power and Signal Integrity and EMC Compliance

    • Signal Integrity, Power Integrity and EMC compliance – Challenges to the Electronic designer
    • Characteristics of PCB as a medium of high speed signals
    • 3D structure of signal transfers between layers
    • Preparation for layout and layout considerations
    • Designing Layers order according to project requirements
    • Distribution of layers contents according to multi voltages circuit
    • Options for implementing the order of layers to comply with EMI requirements
    • Calculating the final thickness of a circuit to meet mechanical requirements
    • Proper planning of the order of the layers – the rules of the copper balance
    • Considerations in components layout in Mixed Signals Design
    • Effective physical location of the PCB termination components
    • Table of recommendations and reasons for choosing a type of termination according to LOGIC
    • Knowledge of signals characteristics according to the electronic classification of the groups
    • Priority considerations for routing between lead groups
    • Basic rules in conductor routing
    • Routing CLOCK, Tree, Daisy-Chain, Stubs
    • Considerations in the routing of data and ADDRESS bus
    • Routing CONTROLLED IMPEDANCE lines
    • INPUT / OUTPUT conductors Insulation
    • Rules for Differential-Pair routing according to the frequency
    • Split according to technology RF/ANALOG/DIGITAL
    • The effect of a signal transition over splitting surfaces POWER/GROUN
    • Common errors that affect IMPEDANCE planning

  • Military EMI Control standard for Equipment

    • Mil Std 461G history, structure, basic requirements for lab facility, scan of the testing requirements, the purpose, rationale and limits. Tailoring of the standard limits

  • Commercial EMI Control standards for Equipment

    • FCC part 15 limits on conducted and radiated emissions.
    • The difference between class A and Class B ITE,
    • The meaning of a Quasi Peak limit.
    • European community- CE EMI control standards,
    • Emissions and susceptibility.
    • The open area test site-OATS and its shielded enclosure replacement.
    • Failure criteria.
    • Scan of the immunity requirements per EN61000-4.

  • An Introductory tour in Hermon Labs

    An Introductory tour in Hermon Labs to acquire familiarity with the environment and testing methods

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